BUF12840_12 Datasheet, PDF (2/26 Pages) Texas Instruments – Programmable Gamma-Voltage Generator with Integrated Two-Bank Memory and External EEPROM

BUF12840
SBOS519A – OCTOBER 2010 – REVISED JULY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
BUF12840
PACKAGE
VQFN-24
PACKAGE/ORDERING INFORMATION⁽¹⁾
PACKAGE
DESIGNATOR
PACKAGE MARKING
RGE
BUF12840
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
PARAMETER
Supply Voltage
V_S
Supply Voltage
V_SD
Supply Input Terminals, SCL, SDA, A0, BKSEL, EA0, EA1, EN, LD: Voltage
Supply Input Terminals, SCL, SDA, A0, BKSEL, EA0, EA1, EN, LD: Current
Output Short-Circuit⁽²⁾
Operating Temperature
Storage Temperature
Junction Temperature
T_J
BUF12840
+22
+6
–0.5 to +6
±10
Continuous
–40 to +95
–65 to +150
+125
UNIT
V
V
V
mA
°C
°C
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Short-circuit to ground. Exposed thermal die is soldered to the PCB using thermal vias. Refer to Texas Instruments application report
QFN/SON PCB Attachment (SLUS271).
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
BUF12840
RGE
UNITS
24 PINS
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
35.6
40.5
10.0
°C/W
0.5
9.9
3.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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