BQ24130_15 Datasheet, PDF (2/29 Pages) Texas Instruments – 600-kHz Synchronous Switch-Mode Host-ControlledBattery/Supercapacitor Charger With 4-A Integrated MOSFETs

bq24130
SLUSAN2C – JULY 2011 – REVISED JUNE 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN
1, 20
2, 3
4
5
6
7
8
9
NAME
SW
PVCC
AVCC
STAT
TS
CMOD
VREF
AGND
10
ISET1
11
CELL
12
BAT
13
SRN
14
SRP
15
ISET2
16
17
18, 19
REGN
BTST
PGND
PowerPAD™ Pad
TYPE
P
P
P
O
I
I
P
P
I
I
I
I
P/I
I
P
P
Pad
PIN FUNCTIONS
FUNCTION DESCRIPTION
Switching node, charge current output inductor connection. Connect the 0.47-µF bootstrap capacitor from
SW to BTST.
Charger input voltage. Connect at least 10-µF ceramic capacitor from PVCC to PGND and place it as
close as possible to IC.
IC power positive supply. Place a 1-µF ceramic capacitor from AVCC to AGND and place it as close as
possible to IC. Place a 10 ohm resistor from input side to AVCC pin to filter the noise. For 5 V input, a 5-Ω
resistor is recommended.
Open-drain charge status pin with 10-kΩ pull up to power rail. The STAT pin can be used to drive LED or
communicate with the host processor. It indicates various charger operations: LOW when charge in
process, HIGH when charge complete or SLEEP mode. Blinking when fault occurs, such as charge
suspend, and input overvoltage.
Temperature qualification voltage input. Connect a negative temperature coefficient thermistor. Program
the hot and cold temperature window with a resistor divider from VREF to TS to AGND. The temperature
qualification window can be set to 5-40ºC or wider. The 103AT thermister is recommended.
Charge mode selection: low (pull down to AGND) for pre-charge current as set by ISET2 pin and high (pull
up to VREF) for fast charge current as set by ISET1 pin. If the battery voltage reaches the voltage
regulation set point, IC changes to voltage regulation mode regardless of CMOD pin input.
3.3 V reference voltage output. Place a 1-µF ceramic capacitor from VREF to AGND pin close to the IC.
This voltage could be used for programming charge current regulation on ISET1 and ISET2 pins,
programming the threshold of TS pin, and the pull-up rail of STAT pin and CELL pin.
Analog ground. Ground connection for low-current sensitive analog and digital signals. On PCB layout,
connect to the analog ground plane, and only connect to PGND through the PowerPad underneath the IC.
Fast charge current set point. Use a voltage divider from VREF to AGND to set this value.
V_(ISET1)
I_(CHG) = _{20 ´ R(SR)}
The charger is disabled when ISET1 pin voltage is below 50mV and is enabled when ISET1 pin voltage is
above 100mV.
Cell selection pin. Set CELL pin LO for 1-cell, Float for 2-cell, and HI for 3-cell with a fixed 4.2 V per cell.
Battery voltage remote sense. Directly connect a kelvin sense trace from the battery pack positive terminal
to the BAT pin to accurately sense the battery pack voltage. Place a 0.1-µF capacitor from BAT to AGND
close to the IC to filter high frequency noise.
Charge current sense resistor, negative input. A 0.1-µF ceramic capacitor is placed from SRN to SRP to
provide differential-mode filtering. A 0.1-µF ceramic capacitor is placed from SRN pin to AGND for
common-mode filtering.
Charge current sense resistor, positive input. A 0.1-µF ceramic capacitor is placed from SRN to SRP to
provide differential-mode filtering. A 0.1-µF ceramic capacitor is placed from SRP pin to AGND for
common-mode filtering.
Pre-charge current set point. Use a voltage divider from VREF to AGND to set this value.
V_{(IS ET2 )}
I_(PRECHG) = _{100 ´ R(SR)}
PWM low side driver positive 6V supply output. Connect a 1-µF ceramic capacitor from REGN to PGND
pin, close to the IC. Use for low side driver and high-side driver bootstrap voltage by integrated diode from
REGN to BTST.
PWM high side driver positive supply. Connect the 47 nF bootstrap capacitor from SW to BTST.
Power ground. Ground connection for high-current power converter node. On PCB layout, connect directly
to source of low-side power MOSFET, to ground connection of in put and output capacitors of the charger.
Only connect to AGND through the PowerPAD underneath the IC.
Exposed pad beneath the IC. Always solder PowerPAD to the board, and have vias on the PowerPAD
plane star-connecting to AGND and ground plane for high-current power converter. It also serves as a
thermal pad to dissipate the heat.
PART NUMBER
bq24130
MARKING
bq24130
ORDERING INFORMATION⁽¹⁾
PACKAGE
ORDERING NUMBER
20-pin 3.5 x 4.5mm² QFN
bq24130RHLR
bq24130RHLT
QUANTITY
3000
250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
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