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BQ24050 Datasheet, PDF (2/37 Pages) Texas Instruments – 800mA Single Cell Li-Ion Battery Charger With Automatic Adaptor/USB Detection
bq24050
bq24052
bq24055
SLUS940A – SEPTEMBER 2009 – REVISED SEPTEMBER 2009.................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION
The charger power stage and charge current sense functions are fully integrated. The charger function has high
accuracy current and voltage regulation loops, charge status display, and charge termination. The precharge
current and termination current threshold are programmed via an external resistor. The fast charge current value
is also programmable via an external resistor.
VO(REG)
4.2 V
4.2 V
4.2 V
VOVP
6.6 V
6.6 V
6.6 V
RNTC
10 kΩ
100 kΩ
10 kΩ
AVAILABLE OPTIONS
PG
PACKAGE
No
10 PIN 2 × 2mm2 DFN
No
10 PIN 2 × 2mm 2 DFN
Yes
12 PIN 2 × 3mm 2 DFN
DEVICES
bq24050
bq24052
bq24055
MARKING
CVC
CGT
CGU
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
ESD
TJ
TSTG
Input Voltage
Input Current
Output Current (Continuous)
Output Sink Current
Electrostatic discharge
(IEC61000-4-2) (2)
Junction temperature
Storage temperature
IN (with respect to VSS)
OUT (with respect to VSS)
PRE-TERM, ISET, ISET2, TS, CHG, PG, D+, D–,
(with respect to VSS)
IN
OUT
CHG
IN, OUT, TS
1µF between IN and GND,
1µF between TS and GND,
2µF between OUT and GND,
x5R Ceramic or equivalent
VALUE
–0.3 to 30
–0.3 to 7
–0.3 to 7
1.25
1.25
15
8 contact
15 Air
–40 to 150
–65 to 150
UNIT
V
V
V
A
A
mA
kV
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) The test was performed on IC pins that may potentially be exposed to the customer at the product level. The bq2405x IC requires a
minimum of the listed capacitance, external to the IC, to pass the ESD test. The D+ D- lines require clamp diodes such as
CM1213A-02SR from CMD to protect the IC for this testing.
PACKAGE DISSIPATION RATINGS(1) (2)
PACKAGE
2 × 2 mm2
2 × 3 mm2
RθJA
60°C/W
58°C/W
RθJC
8.8°C/W
5.3°C/W
TA ≤ 25°C
POWER RATING
1.66W
1.72W
DERATING FACTOR
TA > 25°C
16.6mW/°C
17.2mW/°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a copper pad on the board. This is
connected to the ground plane by a 2×3 via matrix
2
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