AMC1100 Datasheet, PDF (2/22 Pages) Texas Instruments – Fully-Differential Isolation Amplifier for Energy Metering

AMC1100
SBAS562 – APRIL 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE AND ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over the operating ambient temperature range, unless otherwise noted.
Supply voltage, VDD1 to GND1 or VDD2 to GND2
Analog input voltage at VINP, VINN
Input current to any pin except supply pins
Maximum junction temperature, T_J Max
Electrostatic discharge (ESD)
ratings,
all pins
Human body model (HBM)
JEDEC standard 22, test method A114-C.01
Charged device model (CDM)
JEDEC standard 22, test method C101
VALUE
–0.5 to 6
GND1 – 0.5 to VDD1 + 0.5
±10
+150
±2500
±1000
UNIT
V
V
mA
°C
V
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
AMC1100
DUB (SOP)
8 PINS
75.1
61.6
39.8
27.2
39.4
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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