TLK1201ARCP Datasheet, PDF (18/21 Pages) Texas Instruments – ETHERNET TRANSCEIVERS

TLK1201ARCP, TLK1201AIRCP
ETHERNET TRANSCEIVERS
SLLS580A – FEBRUARY 2004 – REVISED JUNE 2004
MECHANICAL DATA
RCP (S-PQFP-G84)
PowerPAD™ PLASTIC QUAD FLATPACK
0,50
48
0,27
0,17
33
0,08 M
49
32
Thermal Pad
(See Note D)
www.ti.com
64
1
0,85
0,75
1,00 MAX
17
16
7,50 TYP
10,20
9,80 ^SQ
12,20
11,80 ^SQ
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0° - 7°
0,75
0,45
4147711/A 10/98
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This
pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
#IMPLIED. Dummy target for KhKIz262casm
#IMPLIED. Dummy target for BhKIz1f4casm
18