JM38510-12501BGA Datasheet, PDF (18/21 Pages) Texas Instruments – LF198JAN Monolithic Sample-and-Hold Circuits

PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2013
PACKAGING INFORMATION
Orderable Device
JL198BGA
JL198SGA
JM38510/12501BGA
JM38510/12501SGA
M38510/12501BGA
M38510/12501SGA
Status Package Type Package Pins Package Qty
(1)
Drawing
ACTIVE
TO-99
LMC 8
20
ACTIVE
TO-99
LMC 8
20
ACTIVE
TO-99
LMC 8
20
ACTIVE
TO-99
LMC 8
20
ACTIVE
TO-99
LMC 8
20
ACTIVE
TO-99
LMC 8
20
Eco Plan
(2)
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Call TI
TBD
Call TI
Call TI
TBD
Call TI
Call TI
TBD
Call TI
Call TI
TBD
Call TI
Call TI
TBD
Call TI
Call TI
Op Temp (°C) Top-Side Markings
(4)
-55 to 125
JL198BGA
JM38510/12501BGA Q ACO
JM38510/12501BGA Q >T
-55 to 125
JL198SGA
JM38510/12501SGA Q ACO
JM38510/12501SGA Q >T
-55 to 125
JL198BGA
JM38510/12501BGA Q ACO
JM38510/12501BGA Q >T
-55 to 125
JL198SGA
JM38510/12501SGA Q ACO
JM38510/12501SGA Q >T
-55 to 125
JL198BGA
JM38510/12501BGA Q ACO
JM38510/12501BGA Q >T
-55 to 125
JL198SGA
JM38510/12501SGA Q ACO
JM38510/12501SGA Q >T
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
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