TLK2521 Datasheet, PDF (17/19 Pages) Texas Instruments – 1 to 2.5 Gbps TRANSCEIVER

TLK2521
1 to 2.5 Gbps TRANSCEIVER
SLLS574B − JULY 2003 − REVISED JANUARY 2004
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package application report, TI (SLMA002), available via the TI Web pages beginning at
URL: http://www.ti.com.
Figure 13. Example of a Thermal Land
For the TLK2521, this thermal land should be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground pin landing pads be connected directly to the grounded thermal land. The land size
should be as large as possible without shorting device signal pins. The thermal land may be soldered to the
exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout, TI (SLLA020).
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
17