THS4631 Datasheet, PDF (17/27 Pages) Texas Instruments – HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBAND FET-INPUT OPERATIONAL AMPLIFIER

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Results are with no air flow and PCB size = 3" x 3 "
θ_JA = 58.4°C/W for the 8-pin MSOP with
PowerPAD (DGN).
θ_JA = 98°C/W for the 8-pin SOIC high-K test PCB
(D).
θ_JA = 158°C/W for the 8-pin MSOP with
PowerPAD, without solder.
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to not only consider quiescent power dissi-
pation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem
DESIGN TOOLS EVALUATION FIXTURE,
SPICE MODELS, AND APPLICATIONS
SUPPORT
Texas Instruments is committed to providing its cus-
tomers with the highest quality of applications sup-
port. To support this goal an evaluation board has
been developed for the THS4631 operational ampli-
fier. The board is easy to use, allowing for straightfor-
ward evaluation of the device. The evaluation board
can be ordered through the Texas Instruments web
site, www.ti.com, or through your local Texas Instru-
ments sales representative. The board layers are
provided in Figure 47, Figure 48, and Figure 49. The
bill of materials for the evaluation board is provided in
Table 2.
THS4631
SLOS451A – DECEMBER 2004 – REVISED MARCH 2005
Figure 48. EVM Layers 2 and 3, Ground
Figure 47. EVM Top Layer
Figure 49. EVM Bottom Layer
17