OPA354 Datasheet, PDF (17/23 Pages) Texas Instruments – 250MHz, Rail-to-Rail I/O, CMOS OPERATIONAL AMPLIFIERS

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PACKAGE OPTION ADDENDUM
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
OPA2354AIDDA
OPA2354AIDDAR
OPA2354AIDGKR
OPA2354AIDGKT
OPA354AIDBVR
OPA354AIDBVT
OPA354AIDDA
OPA354AIDDAR
OPA4354AID
OPA4354AIDR
OPA4354AIPWR
OPA4354AIPWRG4
OPA4354AIPWT
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
Package
Type
SO
Power
PAD
SO
Power
PAD
MSOP
MSOP
SOT-23
SOT-23
SO
Power
PAD
SO
Power
PAD
SOIC
SOIC
TSSOP
TSSOP
TSSOP
Package
Drawing
DDA
DDA
DGK
DGK
DBV
DBV
DDA
DDA
D
D
PW
PW
PW
Pins Package Eco Plan ⁽²⁾
Qty
8 100
None
Lead/Ball Finish MSL Peak Temp ⁽³⁾
CU SNPB Level-3-235C-168 HR
8 2500
None
CU SNPB Level-3-235C-168 HR
8 2500
8 250
5 3000
5 250
8 100
None
None
None
None
None
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-3-250C-168 HR
Level-3-250C-168 HR
Level-2-235C-1 YEAR
8 2500
None
Call TI
Level-1-235C-UNLIM
14 58
14 2500
14 2500
14 2500
14 250
None
None
None
None
None
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-3-220C-168 HR
Call TI
Level-3-220C-168 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1