CC3000EM Datasheet, PDF (17/22 Pages) Texas Instruments – TI CC3000 Evaluation Module

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(1) _{See Figure 3-2.}
Table 3-1. Module Layout Guidelines
Guideline Description
The proximity of ground vias must be close to the pad.
Signal traces must not be run underneath the module on the layer where the module is mounted.
Have a complete ground pour in layer 2 for thermal dissipation.
Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
Increase the ground pour in the first layer and have all of the traces from the first layer on the inner
layers, if possible.
Signal traces can be run on a third layer under the solid ground layer, which is below the module
mounting layer.
SWRU326-013
Figure 3-2. Module Layout Guidelines
Figure 3-3 shows the trace design for the PCB. A 50-Ω impedance match on the trace to the antenna
should be used. Also, 50-Ω traces are recommended for the PCB layout. Table 3-2 lists the distances
shown in Figure 3-3. Figure 3-4 shows layer 1 with the trace to the antenna over ground layer 2. Table 3-3
and Figure 3-5 describe instances of good layout practices for the antenna and RF trace routing.
SWRU326 – November 2012
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Layout Guidelines
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