 English |
|
|
|
|
|
|
|
| DRV8844_15 Datasheet, PDF (15/25 Pages) Texas Instruments – DRV8844 Quad ½-H-Bridge Driver IC | |||
| |||
| ◁ |
www.ti.com
11 Layout
DRV8844
SLVSBA2C â JULY 2012 â REVISED MAY 2015
11.1 Layout Guidelines
The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver
device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used
when connecting PCB layers. These practices minimize inductance and allow the bulk capacitor to deliver high
current.
Small-value capacitors should be ceramic, and placed closely to device pins.
The high-current device outputs should use wide metal traces.
The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to
connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias help dissipate the
I2 Ã RDS(on) heat that is generated in the device.
11.2 Layout Example
CP1
CP2
VCP
VM
OUT1
VNEG
OUT2
OUT3
VNEG
OUT4
VM
NC
NC
VNEG
VNEG
IN1
EN1
IN2
EN2
IN3
EN3
IN4
EN4
LGND
nFAULT
nSLEEP
nRESET
V3P3OUT
Figure 13. Layout Schematic
11.3 Thermal Considerations
The DRV8844 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately
150°C, the device will be disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient
heatsinking, or too high an ambient temperature.
Copyright © 2012â2015, Texas Instruments Incorporated
Product Folder Links: DRV8844
Submit Documentation Feedback
15
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese