CD54HC173_08 Datasheet, PDF (14/20 Pages) Texas Instruments – High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State

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PACKAGE MATERIALS INFORMATION
19-Mar-2008
*All dimensions are nominal
Device
CD74HC173M96
CD74HC173NSR
CD74HC173PWR
CD74HCT173M96
Package Type
SOIC
SO
TSSOP
SOIC
Package Drawing Pins
D
16
NS
16
PW
16
D
16
SPQ
2500
2000
2000
2500
Length (mm)
333.2
346.0
346.0
333.2
Width (mm)
345.9
346.0
346.0
345.9
Height (mm)
28.6
33.0
29.0
28.6
Pack Materials-Page 2