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ADS6149_1 Datasheet, PDF (10/69 Pages) Texas Instruments – 14/12-Bit, 250/210 MSPS ADCs With DDR LVDS and Parallel CMOS Outputs
ADS6149/ADS6129
ADS6148/ADS6128
SLWS211B – JULY 2008 – REVISED OCTOBER 2008 ..................................................................................................................................................... www.ti.com
TIMING REQUIREMENTS – LVDS AND CMOS MODES(1)
Typical values are at 25°C, AVDD = 3.3V, DRVDD = 1.8V, sampling frequency = 250 MSPS, sine wave input clock,
CLOAD = 5pF(2), RLOAD = 100Ω(3), LOW SPEED mode disabled, unless otherwise noted.
Min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = 3.3V, DRVDD = 1.7V to
1.9V.
PARAMETER
ta
Aperture delay
tj
Aperture jitter
Wake-up time
TEST CONDITIONS
The delay in time between the rising edge of the input sampling clock and
the actual time at which the sampling occurs
Time to valid data after coming out of STANDBY mode
Time to valid data after coming out of PDN GLOBAL mode
Time to valid data after stopping and restarting the input clock
ADC Latency(4)
Default, after reset
DDR LVDS MODE (5)
tsu
Data setup time
th
Data hold time
tPDI
Clock propagation delay
tdelay
LVDS bit clock duty cycle
Data valid (6) to zero-crossing of CLKOUTP
Zero-crossing of CLKOUT to data becoming invalid(6)
Input clock rising edge cross-over to output clock rising edge cross-over
100 MSPS ≤ Sampling frequency ≤ 250 MSPS
Duty cycle of differential clock, (CLKOUTP–CLKOUTM)
100 MSPS ≤ Sampling frequency ≤ 250 MSPS
tRISE,
tFALL
Data rise time,
Data fall time
Rise time measured from –100 mV to 100 mV
Fall time measured from 100 mV to –100 mV
1 MSPS ≤ Sampling frequency ≤ 250 MSPS
tCLKRISE,
tCLKFALL
Output clock rise time,
Output clock fall time
Rise time measured from –100 mV to 100 mV
Fall time measured from 100 mV to –100 mV
1 MSPS ≤ Sampling frequency ≤ 250 MSPS
tOE
Output enable (OE) to data delay
PARALLEL CMOS MODE(7)
tSTART
tDV
tPDI
Input clock to data delay
Data valid time
Clock propagation delay
tdelay
Output clock duty cycle
Time to valid data after OE becomes active
Input clock rising edge cross-over to start of data valid(8)
Time interval of valid data(8)
Input clock rising edge cross-over to output clock rising edge cross-over
100 MSPS ≤ Sampling frequency ≤ 150 MSPS
Duty cycle of differential clock, (CLKOUT)
100 MSPS ≤ Sampling frequency ≤ 150 MSPS
tRISE,
tFALL
Data rise time,
Data fall time
Rise time measured from 20% to 80% of DRVDD,
Fall time measured from 80% to 20% of DRVDD,
1 MSPS ≤ Sampling frequency ≤ 250 MSPS
tCLKRISE,
tCLKFALL
Output clock rise time,
Output clock fall time
Rise time measured from 20% to 80% of DRVDD,
Fall time measured from 80% to 20% of DRVDD,
1 MSPS ≤ Sampling frequency ≤ 150 MSPS
tOE
Output enable (OE) to data delay Time to valid data after OE becomes active
MIN TYP MAX UNIT
0.7 1.2 1.7 ns
170
fs rms
0.3
1
µs
25 100
10
clock
cycles
18
clock
cycles
0.8 1.2
ns
0.25 0.6
ns
0.2 × ts + tdelay
ns
5.0 6.2 7.5 ns
52%
0.08 0.14 0.2 ns
0.08 0.14 0.2 ns
40
ns
3.2 ns
0.7 1.5
ns
0.78 × ts + tdelay
5 6.5
8 ns
50%
0.7 1.2
2 ns
0.5
1 1.5 ns
20
ns
(1) Timing parameters are specified by design and characterization and not tested in production.
(2) CLOAD is the effective external single-ended load capacitance between each output pin and ground
(3) RLOAD is the differential load resistance between the LVDS output pair.
(4) At higher frequencies, tPDI is greater than one clock period and overall latency = ADC latency + 1.
(5) Measurements are done with a transmission line of 100Ω characteristic impedance between the device and the load. Setup and hold
time specifications take into account the effect of jitter on the output data and clock.
(6) Data valid refers to LOGIC HIGH of +100mV and LOGIC LOW of –100mV.
(7) For Fs> 150 MSPS, it is recommended to use external clock for data capture and NOT the device output clock signal (CLKOUT).
(8) Data valid refers to LOGIC HIGH of 1.26V and LOGIC LOW of 0.54V.
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