SN74LVT8986_07 Datasheet, PDF (1/54 Pages) Texas Instruments – 3.3-V LINKING ADDRESSABLE SCAN PORTS MULTIDROP-ADDRESSABLE IEEE STD 1149.1 (JTAG) TAP TRANSCEIVERS

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SN54LVT8986, SN74LVT8986
3.3-V LINKING ADDRESSABLE SCAN PORTS
MULTIDROP-ADDRESSABLE IEEE STD 1149.1 (JTAG) TAP TRANSCEIVERS
SCBS759E – OCTOBER 2002 – REVISED MAY 2007
FEATURES
• Members of the Texas Instruments (TI) Family
of JTAG Scan-Support Products
• Extend Scan Access From Board Level to
Higher Level of System Integration
• Three IEEE Std 1149.1-Compatible
Configurable Secondary Scan Paths to One
Primary Scan Path
• Multiple Devices Can Be Cascaded to Link 24
Secondary Scan Paths to One Primary Scan
Path
• Simple (Linking Shadow) Protocol Is Used to
Connect the Primary Test Access Port (TAP)
to Secondary TAPs. This Single Protocol Is
Used to Address and Configure the
Secondary Scan Path.
• LASP (8986) and ASP (8996) Can Be
Configured on the Same Backplane Using
Similar Shadow Protocols
• Linking Shadow Protocols Can Occur in Any
of Test Logic Reset, Run Test/Idle, Pause DR,
Pause IR TAP States to Provide
Board-to-Board and Built In Self Test
• Bypass (BYP₅–BYP₀) Forces Primary to
Configured Secondary Paths Without Use of
Linking Shadow Protocols
• Connect (CON₂–CON₀) Provides Indication of
Primary-to-Secondary Paths Connections
• Secondary TAPs Can Be Configured at High
Impedance Via the OE Input to Allow an
Alternate Test Master to Take Control of the
Secondary TAPs
• High-Drive Outputs (–32 mA I_OH, 64 mA I_OL)
Support Backplane Interface at Primary
Outputs and High Fanout at Secondary
Outputs
• While Powered at 3.3 V, Both Primary and
Secondary TAPs Are Fully 5 V Tolerant for
Interfacing 5 V and/or 3.3 V Masters and
Targets
• Package Options Include Plastic BGA (GGV)
and LQFP (PM) Packages and Ceramic Quad
Flat (HV) Packages Using 25-mil
Center-to-Center Spacing
DESCRIPTION/ORDERING INFORMATION
The 'LVT8986 linking addressable scan ports (LASPs) are members of the TI family of IEEE Std 1149.1 (JTAG)
scan-support products. The scan-support product family facilitates testing of fully boundary-scannable devices.
The LASP applies linking shadow protocols through the test access port (TAP) to extend scan access to the
system level and divide scan chains at the board level.
The LASP consists of a primary TAP for interfacing to the backplane IEEE Std 1149.1 serial-bus signals (PTDI,
PTMS, PTCK, PTDO, PRTST) and three secondary TAPs for interfacing to the board-level IEEE Std 1149.1
serial-bus signals. Each secondary TAP consists of signals STDI_x, STMS_x, STCK_x, STDO_x, and STRST_x.
Conceptually, the LASP is a gateway device that can be used to connect a set of primary TAP signals to a set of
secondary TAP signals – for example, to interface backplane TAP signals to a board-level TAP. The LASP
provides all signal buffering that might be required at these two interfaces. Primary-to-secondary TAP
connections can be configured with the help of linking shadow protocol or protocol bypass (BYP₅–BYP₀) inputs.
All possible configurations are tabulated in Function Tables 1, 2, and 3.
ORDERING INFORMATION
T_A
–40°C to 85°C
–55°C to 125°C
PACKAGE ⁽¹⁾
PBGA – GGV
PBGA – ZGV
LQFP – PM
CFP – HV
ORDERABLE PART NUMBER
SN74LVT8986GGV
SN74LVT8986ZGV
SN74LVT8986PM
SNJ54LVT8986HV
TOP-SIDE MARKING
LVT8986
LVT8986
LVT8986
SNJ54LVT8986HV
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2007, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.