SIA436DJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 8 V (D-S) MOSFET

New Product
N-Channel 8 V (D-S) MOSFET
SiA436DJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω) Max.
0.0094 at V_GS = 4.5 V
0.0105 at V_GS = 2.5 V
8
0.0125 at V_GS = 1.8 V
0.0180 at V_GS = 1.5 V
0.0360 at V_GS = 1.2 V
I_D (A)^a
12
12
12
12
12
Q_g (Typ.)
15 nC
PowerPAK SC-70-6L-Single
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switch for Portable Applications such as Smart
Phones, Tablet PCs and Mobile Computing
- Low Voltage Gate Drive
- Low Voltage Drop
- Power Switch for ICs
D
D
6
D
5
2.05 mm ^S
4
1
D
2
D
3
G
S
2.05 mm
Marking Code
Part # code
AOX
XXX
Lot Traceability
and Date code
Ordering Information: SiA436DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
8
V
V_GS
±5
T_C = 25 °C
12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
12^a
12^{a, b, c}
T_A = 70 °C
12^{a, b, c}
A
Pulsed Drain Current (t = 300 µs)
I_DM
50
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
12^a
2.9^{b, c}
T_C = 25 °C
19
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)^{d, e}
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
t≤5s
R_thJA
28
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
5.3
36
°C/W
6.5
Notes:
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 63535
www.vishay.com
S11-2242-Rev. A, 14-Nov-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000