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U3750BM Datasheet, PDF (6/20 Pages) TEMIC Semiconductors – One Chip Telephone Circuit
U3750BM
TELEFUNKEN Semiconductors
Parameters
Available current
Reception
Receiving gain
GR = VR/VL
AGC
Psophometric receiving
noise
Receiving distortion
Receiver output impedance
Receiver output offset
Sidestone (VR/VM)
Z line matching impedance
Ringer
Turn on voltage
Turn off voltage
Current consumption
without load
Output voltage swing
Output tone frequencies
Test Conditions / Pins
Close switch S4
IL = 28 mA
IL = 60 mA
figure 3
Pin 14
VL = 0.3 VRMS
IL = 28 mA (GR max)
IL = 60 mA (GR min)
IL = 28 to 60 mA
figure 4
VL = 0V, IL = 28 mA
figure 4
Pin 29–30
IL = 15 mA, VR = 2.8 Vpp
IL = 28 mA, VR = 5.5 Vpp
IL = 60 mA, VR = 5.0 Vpp
figure 4
VR = 50 mVRMS,
IL = 28 mA
figure 4
Pin 29–30
IL = 28 mA
figure 4
Pin 29–30
IL = 28 mA
figure 3
VL = 0.3 VRMS
IL = 28 and 60 mA
figure 4
Measured at pin VIR
figure 5
figure 5
VIR = 18 V
Load = 10 kW
figure 5
Pin 38 grounded
Symbol
GR
DGR
VON
VOFF
VOUT
Min.
7.0
35
10
2.5
–6
45
–650
580
9.5
VIR–2
Pin 38 open
Sweep frequencies
Leakage current
Pin 39 grounded
Pin 39 open
VIR = 30 V
IIL at VIL = 0 V
Pins 38 and 39
figure 5
Typ.
8
40
11
4
–7
65
36
660
16
10.5
1.2
1458
1166
547
438
4.0
9.1
Max. Unit
mA
12
5.5
dB
–8
–65 dBmp
3
3
%
3
85
W
+650
mV
40
dB
750
W
18.0
V
V
1.5
mA
Vp
Hz
Hz
5
mA
6 (20)
Rev. A1: 16.07.1996