108-2375 Datasheet, PDF (10/10 Pages) TE Connectivity Ltd – STRADA Mesa* High Speed Mezzanine Press-Fit Differential Connector System

108-2375
T-Rise Test Board Description – The test board used for the T-Rise testing has a nominal thickness of
1.57 mm. The power contact area of the board has 2-ounce copper layers on the top and bottom
surfaces with 6.8 mm wide traces connected to the power contacts. In addition, 2 internal 2-ounce
copper planes are added, evenly spaced through the thickness of the board. The internal planes are
not connected to the contacts. The boards are designed to allow 1, 2, 3, 4, 5 or 6 adjacent power
contacts to be energized. The signal contact area of the test board has a single 2-ounce copper layer
on the bottom surface with 0.6 mm wide traces to the contacts to energize the desired contact chains
for the temperature rise measurements as shown in Figure 5. The chains used for the signal contact
measurements consist of 1 full column of ground pins and signal pins in the differential pair section of
the connector and 2 full columns of signal pins in the single-ended section of the connector.
NOTE
Test board construction has a significant impact on T-Rise results. It is important that the test
board design be understood and taken into account when interpreting the T-Rise data and
current ratings.
Rev C
10 of 10