CLLE1AX7S0G225M-0.95 Datasheet, PDF (6/13 Pages) TDK Electronics – Ultra Low Inductance Capacitors

General
Specifications
CLL Series – ULI Capacitors
No. Item
Performance
Test or Inspection Method
1
External
No defects which may affect
Appearance
performance.
Inspect with magnifying glass (3×).
2
Insulation
Resistance
100MΩ•μF min.
Apply rated voltage for 60s.
Measure 8 terminal electrodes at the same time.
3
Voltage Proof
Withstand test voltage without
2.5 times rated voltage (DC) shall be applied for 1 to
insulation breakdown or other damage. 5s. Charge / discharge current shall not exceed 50mA.
Measure 8 terminal electrodes at the same time.
4
Capacitance
Within the specified tolerance at
1000hrs age (Per IEC-384-9).
Measuring
Frequency
Withstanding
Voltage
Measuring
voltage
1kHz±10%
10V
≤ 6.3V
1.0 ± 0.2 V_rms
0.5 ± 0.2 V_rms
Measure 8 terminal electrodes at the same time.
5
Dissipation
Factor
(Class 2)
T.C. D.F.
X7R
X7S
0.10 max.
See No.4 in this table for measuring condition.
6
Temperature
Capacitance Change (%)
Characteristics
of Capacitance
No DC Voltage Applied
(Class 2)
X7R: ± 15%
X7S: ± 22%
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
∆C be calculated ref. STEP 3 reading
Step
Temperature (ºC)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
7
Robustness of No sign of termination coming off,
Reflow solder the capacitor on P.C. board (shown in
Terminations
breakage of ceramic, or other abnormal Appendix 1 and 2) and apply a pushing force of 2N for
signs.
10±1s.
2N
Capacitor
P.C. Board
8
Solderability
All terminations shall exhibit a
Completely soak both terminations in
continuous solder coating free from
defects for a minimum of 75% of the
surface area of any individual
solder at 235±5°C for 2±0.5s.
Solder : H63A (JIS Z 3282)
termination. Anomalies other than
dewetting, non-wetting, and pin holes
are not cause for rejection. Ceramic
Flux : Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
surface of A sections shall not be
exposed due to melting or shifting of
termination material.
TDK MLCC US Catalog
A section
Page 234
Version B11