IAF12020A007V Datasheet, PDF (2/18 Pages) TDK Electronics – iAF Series – Non-isolated SMT Power Module

Advance Data Sheet: iAF Series – Non-isolated SMT Power Module
Ordering information:
Product
Identifier
Package Size Platform
i
A
F
TDK
Innoveta
33mm x
13.5mm
iAF
Input
Voltage
12
4.5V to
14V
Output
Current/
Power
020
20
Units
A
Main
Output
Voltage
007
Amps
0.70V to
5.5V
# of
Outputs
Safety
Class
Feature Set
RoHS
Indicator
V
-
0
Single
06
See option
table
-
R
R=RoHS 6
Compliant
Option Table:
Feature Set
Positive
Negative
Logic On/Off Logic On/Off
Sequence
LGA Solder
Bumping*
EPC Solder
Bumping*
Product Label
Marking
00
X
X
x
-000
01
X
X
x
-001
02
X
x
-002
03
X
x
-003
04
X
X
x
-004
05
X
X
x
-005
06
X
x
-006
07
X
x
-007
* LGA solder bumping option is recommended for customers using the DOSA standard land grid array
footprint and EPC soldering bumping is recommended for customers using the inspectable edge plated
castellation pads
Product Offering:
Code
iAF12020A007V
Input Voltage
4.5V-14V
Output Voltage
0.70V-5.5V
Output Current
20A
Maximum
Output Power
110W
Efficiency
95%
3320 Matrix Drive, Suite 100
Richardson, TX 75802
Phone [phone] Toll Free
[phone]
Fax [phone] Toll Free
[phone]
[e-mail]
http://www.tdkinnoveta.com/
©2011 TDK Innoveta Inc.
iAF12_Full_Datasheet_08152011.doc 8/16/2011
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