IAF12020A007V Datasheet, PDF (12/18 Pages) TDK Electronics – iAF Series – Non-isolated SMT Power Module

Advance Data Sheet: iAF Series – Non-isolated SMT Power Module
Thermal Performance:
25
20
15
10
5
0
25
NC
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
2.0 m/s (400 LFM)
Tc, Thermal Limit
45
65
85
105
125
Temperature (oC)
25
20
15
10
5
0
25
NC
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
2.0 m/s (400 LFM)
Tc, Thermal Limit
45
65
85
105
125
Temperature (oC)
Vo=5.0V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) to 400lfm with airflow from pin 3 to pin 2.
Vo=3.3V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) to 400lfm with airflow from pin 3 to pin 2.
25
20
15
10
5
0
25
NC
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
2.0 m/s (400 LFM)
Tc MAX
45
65
85 105 125
Temperature (oC)
Vo=0.7V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) to 400lfm with airflow from pin 3 to pin 2.
iAF12020A007V thermal measurement location – top view
The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is
described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta
recommends that the user verify the module’s thermal performance in the end application. The critical component should
be thermo coupled and monitored, and should not exceed the temperature limit specified in the derating curve above. It is
critical that the thermocouple be mounted in a manner that gives direct thermal contact or significant measurement errors
may result. TDK Innoveta can provide modules with a thermocouple pre-mounted to the critical component for system
verification tests.
©2011 TDK Innoveta Inc.
iAF12_Full_Datasheet_08152011.doc 8/16/2011
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