ICF12005A007V Datasheet, PDF (11/16 Pages) TDK Electronics – ICF Series – Non-isolated SMT Power Module

Advance Data Sheet: iCF Series – Non-isolated SMT Power Module
Thermal Performance:
4
4
3
3
2
1
NC
Tc, Thermal Limit
0
45
65
85
105
125
Temperature (°C)
2
NC
1
Tc, Thermal Limit
0
45
65
85
105
125
Temperature (°C)
Vo=5.5V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) with airflow from pin7 to pin 3.
4
3
2
1
NC
Tc, Thermal Limits
0
45
65
85
105
125
Temperature (°C)
Vo=0.7V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) with airflow from pin 7 to pin 3.
Vo=3.3V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) with airflow from pin 7 to pin 3.
Temperature measurement
location on PWB Cu
L1
Q1
Best Orientation
airflow
iCF12003A007V thermal measurement location – top view
The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is
described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta
recommends that the user verify the module’s thermal performance in the end application. The critical component should
be thermo coupled and monitored, and should not exceed the temperature limit specified in the derating curve above. It is
critical that the thermocouple be mounted in a manner that gives direct thermal contact or significant measurement errors
may result. TDK Innoveta can provide modules with a thermocouple pre-mounted to the critical component for system
verification tests.
©2010 TDK Innoveta Inc.
iCF12_3A_Full_Datasheet_091010.doc 9/10/2010 rev 1.1
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