TCS3404 Datasheet, PDF (38/40 Pages) TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS – DIGITAL COLOR SENSORS

TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
MANUFACTURING INFORMATION
The CS and FN packages have been tested and has demonstrated an ability to be reflow soldered to a PCB
substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 12. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217°C (T1)
Time above 230°C (T2)
Time above T_peak −10°C (T3)
Peak temperature in reflow
Temperature gradient in cooling
REFERENCE
t_soak
t₁
t₂
t₃
T_peak
TCS3404/14
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max −5°C/sec
T_peak
T₃
T₂
T₁
Not to scale — for reference only
Time (sec)
t₃
t₂
t_soak
t₁
Figure 35. Solder Reflow Profile Graph
Copyright E 2011, TAOS Inc.
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The LUMENOLOGY r Company
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