TCS3404 Datasheet, PDF (34/40 Pages) TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS – DIGITAL COLOR SENSORS

TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
PACKAGE CS
TOP VIEW
2095
MECHANICAL DATA
Six-Lead Chipscale
PINOUT
TOP VIEW
SCL SYNC GND
A1 A2 A3
1565
+ 10
END VIEW
685 + 45
1875
350
+ 10
PHOTODIODE ARRAY
405 + 20
B1 B2 B3
SDA V_DD INT
6 y 160 + 30
BOTTOM VIEW
CL of Photodiode
Array Area
463 + 30
CL ^{of Solder Bumps}
128 Nominal
6 y j 300 + 30
950
Nominal
CL of Solder Bumps and
Photodiode Array Area
438 + 30
610 Nominal
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
D. This drawing is subject to change without notice.
Figure 31. Package CS — Six-Lead Chipscale Packaging Configuration
Pb
Lead Free
Copyright E 2011, TAOS Inc.
r
The LUMENOLOGY r Company
r
34
www.taosinc.com