NR3010T1R0N Datasheet, PDF (15/15 Pages) Taiyo Yuden (U.S.A.), Inc – SMD INDUCTORS LOW PROFILE TYPE

PRECAUTIONS
SMD Inductors
Stages
1.Circuit Design
2.PCB Design
3.Considerations for
automatic placement
4.Soldering
5.Cleaning
6.Handling
7.Storage conditions
Precautions
Technical considerations
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
Land pattern design
1.Please refer to a recommended land pattern.
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.This products is reflow soldering only.
3.Please do not add any stress to a product until it returns in
normal temperature after reflow soldering.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
( NR10050 type)
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ˆ
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Surface Mounting
ɾMounting and soldering conditions should be checked beforehand.
ɾApplicable soldering process to this products is reflow soldering only.
1. When installing products, care should be taken not to apply distortion stress as it
may deform the products.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
ʲBRC1608, BRL2012, BRL2518, BRC2016, B̧̡3225Typeʳ
Recommended reflow conditionʢPb free solderʣ
300
200
150ʙ180
5sec max
Peakɿ260ʴ5/ʔ0ˆ
100
30ʶ10sec
90ʶ30sec ^{230ˆ min}
0
̝eating Timeʲsecʳ
ʲNRH24, NR30/40/60/80Typeʳɹ
Recommended reflow conditionʢPb free solderʣ
300
200
150ʙ180
5sec max
Peakɿ250ʴ5/ʔ0ˆ
100
30ʶ10sec
90ʶ30sec ^{230ˆ min}
0
ʲNR10050Typeʳ
̝eating Timeʲsecʳ
Recommended reflow conditionʢPb free solderʣ
300
200
150ʙ180
5sec max
Peakɿ250ʴ5/ʔ0ˆ
100
30ʶ10sec
90ʶ30sec ^{230ˆ min}
Cleaning conditions
1.Washing by supersonic waves shall be avoided.
0
̝eating Timeʲsecʳ
1.If washing by supersonic waves, supersonic waves may cause broken products.
Handling
1.Keep the product away from all magnets and magnetic objects.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting product, care
should be taken not to give any stresses of deflection or
twisting to the board.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.Please do not give the product any excessive mechanical shocks.
2.Please do not add any shock and power to a product in
transportation.
Pick-up pressure
1.Please do not push to add any pressure to a winding part.
Please do not give any shock and push into a ferrite core
exposure part.
Packing
1.Please avoid accumulation of a packing box as much as possible.
Storage
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled.
ɾRecommended conditions
ɹAmbient temperatureɹɹɹɹɹ 0ʙ40ˆ
ɹHumidity
ɹBelow 70% RH
The ambient temperature must be kept below 30ˆ. Even under
ideal storage conditions, solderability of products electrodes
may decrease as time passes. For this reason, product should
be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be
checked before actual usage.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
1.There is a case to be damaged by a mechanical shock.
2.There is a case to be broken by the handling in transportation.
1.Damage and a characteristic can vary with an excessive shock or stress.
1.There is a case that transformation and a product of tape are damaged by
accumulation of a packing box.
1.Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place.
5
˚^{ʂ ౰ࣾΧλϩάΛ͝࢖༻ͷࡍʹ͸ʮ౰ࣾ੡඼ʹؔ͢Δ͓அΓʯΛඞ͓ͣಡΈ͍ͩ͘͞ɻ}
˚^{ʂ Please read the "Notice for TAIYO YUDEN products" before using this catalog.}
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