NRH2410TR68NN4 Datasheet, PDF (12/12 Pages) Taiyo Yuden (U.S.A.), Inc – SMD INDUCTORS SMALL AND LARGE CURRENT TYPE

˙ PRECAUTIONS
SMD Inductors
1. Circuit Design
˗Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems,
Precautions
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where
product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
˗Land pattern design
1. Please refer to a recommended land pattern.
Technical
consider-
ations
˗Land pattern design
Surface Mounting
ɾMounting and soldering conditions should be checked beforehand.
ɾApplicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
˗Adjustment of mounting machine
Precautions 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
consider-
ations
˗Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
˗Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. This products is reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
˗Lead free soldering
Precautions
1. When using products with lead free soldering, we request to use them after confirming of adhesion, temperature of resistance to soldering heat, soldering etc
sufficiently.
˗Recommended conditions for using a soldering iron (NR10050 Type)
ɾPut the soldering iron on the land-pattern.
ɾSoldering iron's temperature - Below 350ˆ
ɾDuration - 3 seconds or less
ɾThe soldering iron should not directly touch the inductor.
˗Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of
the products.
Technical
consider-
ations
ɾBRC1608, BRL2012, BRL2518,
ɾNR30/40/50/60/80, NRV30, NRG40,
BRC2016, BRL3225 Type BRC2518, BRFL2518 NRH24/30, NRS50/60 Type
Recommended reflow condition (Pb free solder) Recommended reflow condition (Pb free solder)
300
150ʙ180
200
5sec max
Peakɿ
260ʴ0/ʔ5ˆ
300
150ʙ180
200
5sec max
Peakɿ
250ʴ5/ʔ0ˆ
ɾNR10050 Type
Recommended reflow condition (Pb free solder)
300
150ʙ180
200
5sec max
Peakɿ
250ʴ0/ʔ5ˆ
30ʶ10sec
100
90ʶ30sec ^{230ˆ min}
30ʶ10sec
100
90ʶ30sec ^{230ˆ min}
30ʶ10sec
100
90ʶ30sec ^{230ˆ min}
0
̝eating Timeʲsecʳ
0
̝eating Timeʲsecʳ
0
̝eating Timeʲsecʳ
5. Cleaning
Precautions
˗Cleaning conditions
1. Washing by supersonic waves shall be avoided.
Technical
consider-
ations
˗Cleaning conditions
1. If washing by supersonic waves, supersonic waves may cause broken products.
6. Handling
˗Handling
1. Keep the product away from all magnets and magnetic objects.
˗Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
Precautions
˗Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
˗Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.É»
˗Packing
1. Please avoid accumulation of a packing box as much as possible.
Technical
consider-
ations
˗Breakaway PC boards (splitting along perforations)
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
˗Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
˗Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
˗Packing
1. There is a case that transformation and a product of tape are damaged by accumulation of a packing box.
7. Storage conditions
˗Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should
be controlled.
Precautions
ɾRecommended conditions
Ambient temperature : 0ʙ40ˆ
Humidity
: Below 70% RH
The ambient temperature must be kept below 30ˆ. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical ˗Storage
consider- 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of
ations
taping/packaging materials may take place.
ˎ This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
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