THM1001TE Datasheet, PDF (8/9 Pages) Tachyonics CO,. LTD – SiGe HBT MMIC POWER AMPLIFIER

Evaluation Board Layout
1. Top layer
Board Size 30 x 30 mm²
THM1001TE
3. Middle2 layer
DC Path
2. Middle1 Layer
Inner GND
4. Bottom layer
Ground Plane
Material & Structure of PCB
Hole14
1
FR4 H1 = 220um
2
FR4 H2 = 200um
3
FR4 H3 = 220um
4
Top Solder Mask
Top Cond 1
Cond 2
Cond 3
Bot Cond 4
Bot Solder Mask
60-8, Gasan-dong, Kumchun-Gu
Seoul, Korea. 153-023
Page 8
http://www.tachyonics.co.kr
Rev. 1.1