BQ4H136EEC45 Datasheet, PDF (11/13 Pages) SynQor Worldwide Headquarters – Industry standard eighth-brick pin-out configuration

Applications Section
Input: 230-400 V
Output: 13.6 V
Current: 45 A
Package: EXTENDED Eighth-brick
APPLICATION CONSIDERATIONS
Start-Up Inhibit Period: Figure E details the Start-Up
Inhibit Period for the BusQor module. At time t0, when Vin
is applied with On/Off pin asserted (enabled), the BusQor
output begins to build up. Before time t1, when the input
voltage is below the UVL threshold, the unit is disabled by
the Input Under-Voltage Lockout feature. When the input
voltage rises above the UVL threshold, the Input Under-
Voltage Lockout is released, and a typical Initial Startup
Inhibit Period of 70 ms is initiated. The output builds up to
90% of the nominal value of 13.6 V in a period of 20 ms
typical (50% load).
At time t2, when the On/Off pin is de-asserted (disabled),
the BusQor output instantly drops to 0 V. Fall time from
13.6 V to 0 V is dependent on output capacitance and any
parasitic trace inductance in the output load circuit.
At time t3, when the On/Off pin is re-asserted (enabled),
the BusQor module output begins to build up after the
inhibit period of 250 ms typical has elapsed.
Refer to the Control Features section of the data sheet
for details on enabling and disabling methods for Bus Qor
modules.
Thermal Derating Test Setup
The curves showing the derating of output current and
power as a function of the baseplate temperature are
taken with the oven setup shown in Figure F. The converter
module is soldered to a carrier PCB that is mounted
horizontally within an oven. The carrier PCB is a four layer
4 oz PCB. A large aluminum heatsink (thermal grease is
applied between the baseplate and the heatsink interface
to minimize the thermal impedance) is attached to the
baseplate to keep the baseplate temperature constant
during thermal testing. A small hole is drilled through the
heatsink in order to attach a thermocouple to the baseplate
of the DTU. Additional thermocouples are attached to
the hottest components before baseplating to monitor
the internal temperature of all of the critical components
during testing. The oven temperature is controlled so as
to keep the baseplate temperature to the desired value.
The baseplate temperature is kept at 100 ^oC or below for
all conditions. If the temperature of an internal component
exceeds 125 ^oC, the output current (power level) is reduced
so as to keep the temperature of all internal components
below 125 ^oC.
Vin
UVLO
On/Off
(N logic)
OFF
ON
t0
t1
Vout
t2
t3
Heat Sink
DUT
Thermocouple
Test PCB
t
Thermal Chamber
Figure F: Thermal chamber setup for derating curves.
Initial
Start-up
Inhibit
Start-up
Inhibit
Time
Start-Up
Figure E: Power Up/Down Diagram (not to scale) showing Start-Up Inhibit Period
Product # BQ4H136EEC45
Phone [phone]
www.synqor.com
Doc.#005-0006641 Rev. C
05/11/16
Page 11