L1M-1N0S-10 Datasheet, PDF (5/10 Pages) Superworld Electronics – High Frequency Chip Inductor

High Frequency Chip Inductor
L1M SERIES
7. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
Electrical Characteristics Test
Inductance (Ls)
Refer to standard electrical characteristics list
Q Factor
DC Resistance
Rated Current
Temperature Rise Test
Solder Heat Resistance
Rated Current < 1A ΔT 20°C Max
Rated Current ≧ 1A ΔT 40°C Max
No mechanical damage.
Remaining terminal electrode : 75% min.
Preheating Dipping Natural
260° C
c ooling
TEST CONDITION
Agilent E4991
Agilent4287
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be some risk
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150° C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 260± 5° C
Flux for lead free: ROL0
Dip Time : 10± 0.5sec.
150° C
60
seconds
10± 0.5
seconds
Solderability
More than 95% of the terminal electrode
should be covered with solder.
Preheating Dipping Natural
245° C
c ooling
Preheat : 150° C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 245± 5° C
Flux for lead free: ROL0
Dip Time : 4± 1sec.
Terminal Strength
Flexture Strength
150° C
60
seconds
4± 1.0
seconds
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
W
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
2 0(.787)
For L Series :
Size Force (Kfg)
1
0.2
2
0.5
3
0.6
4
1.0
5
1.0
6
1.0
7
1.5
Time (sec)
> 30
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be 60
(+ 5) Sec.
45(1.772) 45(1.772)
Bending
4 0(1. 575)
1 00(3 .937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5