L1M-1N0S-10 Datasheet, PDF (10/10 Pages) Superworld Electronics – High Frequency Chip Inductor

High Frequency Chip Inductor
L1M SERIES
9-2.1 Tape Dimension / 12mm
D:1.5 +0.1
Po:4± 0.1
A
P2:2± 0.05
A
P
Ao
D1:1.5± 0.1
t
Ko
Section A-A
S eries
L
Size Bo(mm) Ao(mm) Ko(mm) P(mm)
t(mm) D1(mm)
6
4.95± 0.1 1.93± 0.1 1.93± 0.1 4.0± 0.1 0.24± 0.05 1.5± 0.1
7
4.95± 0.1 3.66± 0.1 1.85± 0.1 8.0± 0.1 0.24± 0.05 1.5± 0.1
9-3. Packaging Quantity
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
Bulk (Bags)
7
1000
4000
20000
40000
12000
6
2000
8000
40000
80000
20000
5
2500
12500
62500
125000
30000
4(11)
3000
15000
75000
150000
50000
4(09)
3000
15000
75000
150000
50000
3(12)
2000
10000
50000
100000
100000
3(09)
4000
20000
100000
200000
150000
2
4000
20000
100000
200000
200000
1
10000
50000
250000
500000
300000
0
15000
75000
375000
750000
-
9-4. Tearing Off Force
F
Top cover tape
165° to 180°
Base tape
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
Room Temp. Room Humidity
(° C)
(%)
5~35
45~85
Room atm Tearing Speed
(hPa)
(mm/min)
860~1060
300
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : -10~ 40° C and 30~70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 10