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ME2302A29T Datasheet, PDF (2/4 Pages) SUNMATE electronic Co., LTD – High-density cell design for ultra low on-resistance
z Absolute Maximum Ratings @ TA = 25°C unless otherwise specified
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Power Dissipation(1)
Continuous
Pulsed
Operating and Storage Junction Temperature Range
Symbol
VDSS
VGSS
ID
PD
TJ, TSTG
Ratings
20
±8
2.5
10
350
-55 to +150
z Electrical Characteristics @ TA = 25°C unless otherwise specified
Parameter
Symbol
Test Conditions
Min Typ
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate–Body Leakage
V(BR)DSS
VGS = 0 V, ID = 10uA
IDSS
VDS = 20 V, VGS = 0 V
IGSS
VGS = ±8 V, VDS = 0 V
ON CHARACTERISTICS(2)
20
--
--
--
--
--
Gate Threshold Voltage
Static Drain–Source On-Resistance
Forward Transconductance
VGS(th)
VDS = VGS, ID = 50uA
RDS(on)
VGS = 4.5 V, ID = 3.6 A
VGS = 2.5 V, ID = 3.1 A
gFS
VDS = 5 V, ID = 3.6 A
DYNAMIC CHARACTERISTICS
0.4
0.75
--
70
--
90
2
7.7
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Ciss
Coss
Crss
VDS = 10 V, VGS = 0 V,
f = 1.0 MHz
SWITCHING CHARACTERISTICS
--
450
--
70
--
43
Turn–On Delay Time
td(on)
--
--
Turn–On Rise Time
Turn–Off Delay Tim
tr
td(off)
VDD = 5 V, ID = 3.6A,
VGS =4.5 V,RGEN=6Ω
--
--
--
--
Turn–Off Fall Time
tf
--
--
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Diode Forward Voltage(2)
VSD
VGS = 0 V, IS = 1.1 A
0.6
0.8
Notes :
(1). Surface Mounted on FR4 Board, t < 10 sec.
(2). Pulse Test: Pulse Width < 300µs, Duty Cycle < 2%
Unit
V
V
A
mW
°C
Max Unit
--
V
1
uA
±100
nA
2.0
V
85
mΩ
115
14
S
--
--
pF
--
15
80
nS
60
25
1.15
V