SD56120C Datasheet, PDF (9/15 Pages) STMicroelectronics – Excellent thermal stability

SD56120C
5
Test circuit
Test circuit
Figure 14. 860 MHz test circuit schematic
TL1
Z1
Z9
Z3
Z5
Z11
Z7
Z6
Z2
Z4
Z10
Z8
TRANSMISSON LINE DIMENSIONS
Z12
TL2
DIMENSION TABLE
DIM
WINX L
WMXML
Z1,Z12 0.215 X TYP
5,46 X TYP
Z2,Z3 0.215 X 0.850 5,46 X 21,59
Z4,Z5 0.344 X 1.000 8,73 X 25,40
Z6,Z7 0.344 X 0.440 8,73 X 11,17
Z8,Z9 0.700 X 0.870 17,78 X 22,10
Z10,Z11 0.215 X 0.670 5,46 X 17,02
TL1 & TL2 0.100 X 2.37 2,54 X 60,20
DIMENSION OF MCROSTRIP
= 1/2 PRINTED BALUN ONLY.
VGG
+
R1
C16
C28
FB1
VDD
R2
C29
C22
L1
R3
C21
C20
C19
C18
RF
INPUT
C1
BALUN1
VGG
+
R4
C31
C17
C2
C3
R1
R5
C30
R7
C6
D.U.T.
C12
C4 C5
R8
C7
R6
C9
C8
C10
C13
C11
C14
C15
L2
FB2
C27
C26
C25
BALUN2
RF
OUTPUT
VDD
C24
C23
Note: 1 Dimensions at component symbols are reference for component placement.
2 Gap between ground & transmission line = 0.056 [1.42] +0.002 [0.05] -0.000 [0.00] typ.
Doc ID 15742 Rev 3
9/15