ESDAXLC6-1MY2 Datasheet, PDF (9/11 Pages) STMicroelectronics – Extra low capacitance single line TVS

ESDAXLC6-1MY2
Recommendation on PCB assembly
4.5
Reflow profile
Figure 15. ST ECOPACK^® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Doc ID 16923 Rev 2
9/11