ESDAVLC8-1BM2 Datasheet, PDF (9/13 Pages) STMicroelectronics – Single line low capacitance Transil for ESD protection

ESDAVLC8-1BM2, ESDAVLC8-1BT2
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 23. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect
Ratio
=
W-----
T
≥ 1.5
Aspect Area = _2----T---L-(---L-^×---+-W----W-------₎ ≥ 0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 24. Recommended stencil window position
Lead footprint on PCB
Package footprint
Lead footprint on PCB
Stencil window
position
0.39 mm
Stencil window
position
0.45 mm
0.05 mm
0.05 mm
Doc ID 16937 Rev 1
9/13