AN900 Datasheet, PDF (9/15 Pages) STMicroelectronics – INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY

INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY
Figure 9. Wire Bonding Operation
The chip is then mounted in a ceramic or plastic package. The package not only protects the
chip from external shocks, but also makes the whole device easier to handle. Theses pack-
ages come in a variety of shapes and sizes depending on the die itself and the application in
which it will be used.
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