AN900 Datasheet, PDF (8/15 Pages) STMicroelectronics – INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY

INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY
Figure 7. Description of The Assembly Process
Wires thinner than a human hair (for microcontrollers the typical value is 33 microns) are re-
quired to connect chips to the external world and enable electronic signals to be fed through
the chip. The process of connecting these thin wires from the chip’s bond pads to the package
lead is called wire bonding (see also graph on next page for more details).
Figure 8. Wire Bonding
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