M24SR04-Y Datasheet, PDF (82/90 Pages) STMicroelectronics – Support of NDEF data structure

Package information
M24SR04-Y M24SR04-G
15.3
UFDFPN8 package information
Figure 23. UFDFPN8 - 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch
dual flat package outline
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1. Max package warpage is 0.05 mm.
2. Exposed copper is not systematic and can appear partially or totally according to the cross section.
3. Drawing is not to scale.
4.
The
(not
central pad
connected)
(the area E2 by D2 in the
in the end application.
above
illustration)
must
be
either
connected
to
V_SS
or
left
floating
82/90
DocID024754 Rev 15