PD85025C Datasheet, PDF (8/10 Pages) STMicroelectronics – RF power transistor - LdmoST family

Package mechanical data
5
Package mechanical data
PD85025C
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Table 8.
Dim.
A
B
C
D
E
F
G
H
I
J
M243 (.230 x .360 2L N/HERM W/FLG) mechanical data
mm.
Inch
Min
Typ
Max
Min
Typ
5.21
5.46
5.59
20.07
8.89
0.10
3.18
1.83
1.27
14.27
5.72
6.48
6.10
20.57
9.40
0.15
4.45
2.24
1.78
0.205
0.215
0.220
0.790
0.350
0.004
0.125
0.072
0.050
0.562
Max
0.225
0.255
0.240
0.810
0.370
0.006
0.175
0.088
0.070
Figure 12. Package dimensions
Controlling dimension: Inches
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