ESDAVLC8-1BU2 Datasheet, PDF (8/11 Pages) STMicroelectronics – Single-line low capacitance Transil

Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
Figure 15. Recommended stencil windows position
ESDAVLC8-1BU2
0.425
1.05
0.425
0.225
0.30
0.040
0.065 0.20
Footprint
0.038
0.320 0.038
Stencil window
4.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
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Doc ID 16546 Rev 2