STM32F101RBT6 Datasheet, PDF (73/89 Pages) STMicroelectronics – Medium-density access line, ARM-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces

STM32F101x8, STM32F101xB
Package characteristics
Figure 37. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline
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1. Drawing is not to scale.
2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to
the VSS or VDD power pads. It is recommended to connect it to VSS.
3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.
Table 47. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
A
0.500
0.550
0.600
0.0197
0.0217
A1
0.000
0.020
0.050
0.0000
0.0008
D
6.900
7.000
7.100
0.2717
0.2756
E
6.900
7.000
7.100
0.2717
0.2756
L
0.300
0.400
0.500
0.0118
0.0157
T
0.152
0.0060
b
0.200
0.250
0.300
0.0079
0.0098
e
0.500
ddd
0.080
0.0197
0.0031
Max
0.0236
0.0020
0.2795
0.2795
0.0197
0.0118
Doc ID 13586 Rev 15
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