ESDAVLC8-4BN4 Datasheet, PDF (7/10 Pages) STMicroelectronics – 4-line very low capacitance Transil™ array for ESD protection

ESDAVLC8-4BN4
Recommendation on PCB assembly
3
Recommendation on PCB assembly
3.1
Stencil opening design
Reference design
• Stencil opening thickness: 100 µm
• Stencil opening for leads: Opening to footprint ratio is 100%.
Figure 17. Recommended stencil window position
T=100 µm and opening
ratio is 100%
180 µm
580 µm
Footprint
Stencil window
Footprint
3.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 µm.
DocID022192 Rev 3
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