SPC56EC74L7 Datasheet, PDF (68/118 Pages) STMicroelectronics – 32-bit MCU family built on the Power Architecture® for automotive body electronics applications

Electrical Characteristics
SPC564Bxx - SPC56ECxx
Table 25. Low voltage power domain electrical characteristics
Symbol C
Parameter
Conditions⁽¹⁾
Value
Unit
Min Typ⁽²⁾ Max⁽³⁾
I_DDMAX(4)
CC
D
RUN mode maximum
average current
I_DDRUN
I_DDHALT
CC
T
RUN mode typical average
current⁽⁷⁾
T
CC P HALT mode current⁽¹¹⁾
I_DDSTOP
P
CC STOP mode current⁽¹²⁾
P
I_DDSTDBY3
(96 KB RAM
retained)
CC
P
P
STANDBY3 mode
current⁽¹⁴⁾
—
at 120 MHz
T_A = 25 °C
at 80 MHz
—
T_A = 25 °C
No clocks active
No clocks active
T_A = 25 °C
T_A = 150 °C
T_A = 25 °C
T_A = 150 °C
—
210 300^(5),(6) mA
—
175^(8),
(9)
240^(9),
(10)
mA
110⁽⁸⁾ 150⁽¹⁰⁾ mA
— 25
35 mA
—
400⁽⁹⁾
1200^(9),
(13)
µA
— 10⁽⁹⁾ 30⁽⁹⁾ mA
—
60
175 µA
— 1000 3000 µA
I_DDSTDBY2
(64 KB RAM
retained)
CC
P
P
STANDBY2 mode
current⁽¹⁵⁾
T_A = 25 °C —
45
135 µA
No clocks active
T_A = 150 °C — 800 2000 µA
I_DDSTDBY1
(8 KB RAM
retained)
CC
T
P
STANDBY1 mode
current⁽¹⁶⁾
T_A = 25 °C —
25
75 µA
No clocks active
T_A = 150 °C — 500 1000 µA
32 kHz OSC
—
T_A = 25 °C —
—
5 µA
Adders in
LP mode
4–40 MHz OSC
CC T
16 MHz IRC
—
T_A = 25 °C —
—
3 mA
—
T_A = 25 °C —
—
500 µA
128 kHz IRC
—
T_A = 25 °C —
—
5 µA
1. V_DD = 3.3 V ± 10% / 5.0 V ± 10%, T_A = −40 to 125 °C, unless otherwise specified All temperatures are based on an
ambient temperature.
2. Target typical current consumption for the following typical operating conditions and configuration. Process = typical,
Voltage = 1.2 V.
3. Target maximum current consumption for mode observed under typical operating conditions. Process = Fast, Voltage =
1.32 V.
4. Running consumption is given on voltage regulator supply (V_DDREG). It does not include consumption linked to I/Os
toggling. This value is highly dependent on the application. The given value is thought to be a worst case value with all
cores and peripherals running, and code fetched from code flash while modify operation on-going on data flash. It is to be
noticed that this value can be significantly reduced by application: switch-off not used peripherals (default), reduce
peripheral frequency through internal prescaler, fetch from RAM most used functions, use low power mode when possible.
5. Higher current may sunk by device during power-up and standby exit. Please refer to in rush current in Table 23.
6. Maximum “allowed” current is package dependent.
7. Only for the “P” classification: Code fetched from RAM: Serial IPs CAN and LIN in loop back mode, DSPI as Master, PLL
as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at max frequency, periodic SW/WDG timer
reset enabled. RUN current measured with typical application with accesses on both code flash and RAM.
8. Subject to change, Configuration: 1 × e200z4d + 4 kbit/s Cache, 1 × eDMA (32 ch), 4 × FlexCAN (2 × 500 kbit/s, 2 ×
125 kbit/s), 10 × LINFlexD (20 kbit/s), 8 × DSPI (4 × 2 Mbit/s, 3 × 4 Mbit/s, 1 × 10 Mbit/s), 40 × PWM (200 Hz), 40 × ADC
Input, 1 × CTU (40 ch.), 1 × FlexRay (2 ch., 10 Mbit/s), 1 × RTC, 4 × PIT, 1 × SWT, 1 × STM. Ethernet and e200z0h
disabled. Also reduced timed I/O channels for smaller packages. RUN current measured with typical application with
accesses on both code flash and RAM.
9. This value is obtained from limited sample set
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