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STCC02-ED5 Datasheet, PDF (6/13 Pages) STMicroelectronics – CONTROL CIRCUIT FOR HOME APPLIANCE MCU BASED APPLICATION
STCC02-ED5
■ Buzzer driver
The MCU can drive a warning buzzer with a 50% PWM signal. The buzzer driver amplifies this signal in
current and translates it from the 5V MCU output to the VCC supply to produce the right sound level from
the buzzer.
The output stage is made of a transistor and a 1.5 kΩ resistor. The transistor is referred to the power
ground COM and is connected by its collector to the output BUZ3. It has a DC current rating of 17 mA and
runs up to 5 kHz. Finally, the resistor is connected between the BUZ3 and VCC pins to discharge the
capacitance of the buzzer at turn off and in off state.
Table 2: Absolute Ratings (limiting values)
Symbol
VDD
VIN
VDS, VCC
VSYN
VMO
Pin
VDD
VIN
DS, VCC
SYN
BUZ1, MAG2, FAN1
Parameter name & conditions
Output supply voltage
Input supply voltage
Door switch and power supply voltage
AC input voltage, RZV = 10kΩ
Output voltage
VI
IN1, IN2, IN3
Input logic voltage
VO ZVS, CDD, /RST Output logic voltage
DS, VCC
MAG2, FAN1
IM
BUZ3
FMAX
PDIS
TAMB
TJ
MAG2, FAN1
IN3, BUZ3
All
AII
All
Maximum sourced current pulse, tp = 10ms
Maximum sunk driver current pulse, tp = 1ms
Maximum DC sourced current
Maximum driver diode reverse current
Maximum DC sourced current
Maximum demagnetization diode reverse
current
Maximum buzzer frequency
Operating dissipation, DIL-16 package (1)
Operating ambient temperature, DIL-16
Operating junction temperature
Storage junction temperature
Note 1: Refer to the Application Recommendations for the calcultation of the functional dissipation.
Value
- 0.3 to 6
- 0.3 to 30
- 0.3 to 30
- 1 to 30
- 0.3 to 30
- 0.3 to VDD
+ 0.3V
- 0.3 to VDD
+ 0.3V
120
120
100
15
10
Unit
V
V
V
V
V
V
V
mA
mA
mA
mA
mA
1
mA
5
kHz
0.65
W
- 10 to 85 °C
- 10 to 150 °C
- 25 to 150 °C
Table 3: Electromagnetic Compatibility Ratings
(TJ = 25°C, according to typical application diagram of page 1, unless otherwise specified)
Symbol Node
Parameter name & conditions
Value Unit
VESD
All pins ESD protection, MIL-STD 883 method 3015, HBM model
±2
kV
Table 4: Thermal Resistance
Symbol
Parameter
Rth(j-a)
DIL-16 thermal resistance junction to ambient
Copper thickness = 35µm
Value
100
Unit
°C/W
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