ESDAVLC6-1BV2 Datasheet, PDF (6/9 Pages) STMicroelectronics – Bidirectional device

Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
Stencil opening thickness: 80 µm
Figure 10. Recommended stencil window position
225
45
160
62.5
ESDAVLC6-1BV2
20
32.5
225
160
32.5
125
50
PCB lands
Solder lands
Stencil lands
4.2
Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Solder paste with fine particles: type 4 (powder particle size 20-38 µm per
IPC J-STD-005).
4.3
Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Tolerance of ± 0.02 mm is recommended.
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Doc ID 023822 Rev 1