ESDAVLC6-1BV2 Datasheet, PDF (5/9 Pages) STMicroelectronics – Bidirectional device

ESDAVLC6-1BV2
3
Package information
Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 8. Package dimensions
205 µm ± 20
25 µm ± 10
50 µm
50 µm
75 µm
200 µm
75 µm
200 µm ± 20
450 µm ± 20
50 µm
50 µm
Figure 9. Footprint recommendation
H = 25 µm
A = 225 µm
B= 225 µm
I = 112.5 µm E= 125 µm
F = 100 µm
J = 325 µm
D = 125 µm
C = 50 µm
G = 500 µm
Doc ID 023822 Rev 1
5/9