ESDAVLC12-1BV2 Datasheet, PDF (6/9 Pages) STMicroelectronics – Single line bidirectional TVS diode for ESD protection

Recommendation on PCB assembly
3
Recommendation on PCB assembly
3.1
Stencil opening design
1. Reference design
a. Stencil opening thickness: 75 μm
Figure 13: Stencil opening dimensions
L
TW
ESDAVLC12-1BV2
Figure 14: Recommended stencil window position in mm (inches)
100 µm
150 µm
3.2
Stencil opening
Stencil thickness: 75 µm (3 mils)
Use of solder paste type 4 mandatory
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-38 μm.
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DocID027160 Rev 2