TDA7437N_06 Datasheet, PDF (32/34 Pages) STMicroelectronics – Digitally controlled audio processor

Package information
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Package information
TDA7437N
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 21. LQFP44 (10x10) Mechanical data and package dimensions
DIM.
A
MIN.
mm
TYP.
MAX.
1.60
MIN.
inch
TYP. MAX.
0.0630
A1 0.05
0.15 0.0020
0.0059
A2 1.35 1.40 1.45 0.0531 0.0551 0.0571
b 0.30 0.37 0.45 0.0118 0.0146 0.0177
c 0.09
0.20 0.0035
0.0079
D 11.80 12.00 12.20 0.4646 0.4724 0.4803
D1 9.80 10.00 10.20 0.3858 0.3937 0.4016
D2 2.00
0.0787
D3
8.00
0.3150
E 11.80 12.00 12.20 0.4646 0.4724 0.4803
E1 9.80 10.00 10.20 0.3858 0.3937 0.4016
E2 2.00
E3
8.00
0.0787
0.3150
e
0.80
0.0315
L 0.45 0.60 0.75 0.0177
0.0295
L1
1.00
0.0394
K
3.5˚(m in.),7˚ (max.)
ccc
0.10
0.0039
Note: 1. The size of exposed pad is variable depending of lead-
frame design pad size. End user should verify “D2” and
“E2” dimensions for each device application.
OUTLINE AND
MECHANICAL DATA
LQFP44 (10 x 10 x 1.40mm)
Exposed Pad Down
32/34
7278839 C