XRAG2_08 Datasheet, PDF (30/33 Pages) STMicroelectronics – 432-bit UHF, EPCglobal Class1 Generation2 and ISO 18000-6C, contactless memory chip with user memory

Package mechanical data
10 Package mechanical data
XRAG2
Figure 21.
UFDFPN6 (MLP6) – 6-lead ultra thin fine pitch dual flat package no lead
1.8 x 2 mm, package outline
D
D2
L
1
E E2
K
6
PIN 1
e
b
A
A1
ddd
1. Drawing is not to scale. Preliminary data.
J5-ME
Table 14.
Symbol
UFDFPN6 (MLP6) - 8-lead ultra thin fine pitch dual flat package no lead
1.8 x 2 mm, package mechanical data⁽¹⁾
millimeters
inches⁽²⁾
Typ
Min
Max
Typ
Min
Max
A
0.55
0.45
0.6
0.022
0.018
0.024
A1
0.02
0
0.05
0.001
0
0.002
b
0.2
0.15
0.25
0.008
0.006
0.01
D
1.8
1.7
1.9
0.071
0.067
0.075
D2
1.3
1.2
1.4
0.051
0.047
0.055
ddd
0.08
0.003
E
2
1.9
2.1
0.079
0.075
0.083
E2
0.95
0.85
1.05
0.037
0.033
0.041
e
0.5
-
-
0.02
-
-
K
0.2
0.008
L
0.25
0.2
0.3
0.01
0.008
0.012
X
0.2
0.008
1. Preliminary data.
2. Values in inches are converted from mm and rounded to 4 decimal digits.
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