TDA7703 Datasheet, PDF (30/32 Pages) STMicroelectronics – Automatic self alignment for image rejection

Package information
7
Package information
TDA7703
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 10. LQFP44 (10x10x1.4mm) mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.30 0.37 0.45 0.012 0.015 0.018
C 0.09
0.20 0.004
0.008
D 11.80 12.00 12.20 0.464 0.472 0.480
D1 9.80 10.00 10.20 0.386 0.394 0.401
D3
8.00
0.315
E 11.80 12.00 12.20 0.464 0.472 0.480
E1 9.80 10.00 10.20 0.386 0.394 0.401
E3
8.00
0.315
e
0.80
0.031
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.039
k
0˚(min.), 3.5˚(typ.), 7˚(max.)
ccc
0.10
0.0039
OUTLINE AND
MECHANICAL DATA
LQFP44 (10 x 10 x 1.4mm)
30/32
Rev 1
0076922 E