CD00251512 Datasheet, PDF (3/16 Pages) STMicroelectronics – N-channel 525 V, 0.95 ohm, 6 A, DPAK, TO-220FP, TO-220

STD7N52DK3, STF7N52DK3, STP7N52DK3
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
V_DS Drain-source voltage (V_GS = 0)
V_GS Gate- source voltage
I_D Drain current (continuous) at T_C = 25 °C
I_D Drain current (continuous) at T_C = 100 °C
I_DM ⁽²⁾ Drain current (pulsed)
P_TOT Total dissipation at T_C = 25 °C
I_AR
Avalanche current, repetitive or not-
repetitive (pulse width limited by T_j max)
Single pulse avalanche energy
E_{AS (starting Tj = 25°C, ID = IAR, VDD = 50 V)}
Gate source ESD(HBM-C = 100 pF,
V_{ESD(G-S) R = 1.5 kΩ)}
dv/dt ⁽³⁾ Peak diode recovery voltage slope
di/dt Diode reverse recovery current slope
V_ISO
Insulation withstand voltage (RMS) from
all three leads to external heat sink
(t = 1 s; TC = 25 °C)
T_stg Storage temperature
T_j Max. operating junction temperature
1. Limited by package
2. Pulse width limited by safe operating area
3. I_SD ≤ 6 A, peak V_DS < V_(BR)DSS.
Value
TO-220 DPAK
525
± 30
6
4
24
90
TO-220FP
6 ⁽¹⁾
4 ⁽¹⁾
24 ⁽¹⁾
25
3
100
2500
20
400
2500
-55 to 150
150
Unit
V
V
A
A
A
W
A
mJ
V
V/ns
A/µs
V
°C
°C
Table 3. Thermal data
Symbol
Parameter
R_thj-case Thermal resistance junction-case max
R_thj-pcb ⁽¹⁾ Thermal resistance junction-pcb max
R_thj-amb Thermal resistance junction-ambient max
T_l
Maximum lead temperature for soldering
purpose
1. When mounted on 1inch² FR-4 board, 2 oz Cu
Value
TO-220 DPAK
1.39
50
62.5
TO-220FP
5
62.5
300
300
Unit
°C/W
°C/W
°C/W
°C
Doc ID 16387 Rev 2
3/16