TS4855_04 Datasheet, PDF (24/27 Pages) STMicroelectronics – LOUDSPEAKER & HEADSET DRIVER WITH VOLUME CONTROL

TS4855
7 PACKAGE INFORMATION
Flip-chip package—18 bumps: TS4855IJT
Package Information
Marking (on top view)
s ST LOGO
s Part number: B55
s Three digit Datecode: YWW
s The dot is for marking the bump1A
Package mechanical data
2440µm
750µm
500µm
866µm
866µm
2170µm
❑ Die size: 2440µm x 2170µm ±30µm
❑
❑
Die height (including bumps): 600µm
Nominal Bumps diameter: 315µm ±10µm
❑ Nominal Bumps height: 250µm ±10µm
❑
❑
Pitch: 500µm ±10µm
Die Height : 350µm ±20µm
600µm
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